| Manufacturer | NIHON SUPERIOR |
| Product Model | Solder Paste SN100CV P820-5 D4 |
SN100CV P820-5 D4 is a low-residue solder paste that minimizes flux residue. It can also reduce porosity caused by the evaporation of the flux. It is also a completely halogen-free solder paste.
Features
Halogen free
Completely halogen-free, being coexistence of environment with workability
Reducing process
Suppressing flux residue and reducing process
Specifications
*2 Insulation resistance value: Condition B 85±2℃, relative temperature and humidity 80~90%RH 168 hours
*3 Electromigration experiment: condition B 85±2℃, relative temperature and humidity 80~90%RH 1000 hours
Specification Table：
| Item | SN100CV P820-5 D4 |
|---|---|
| Composition | Sn-0.7 Cu-0.05 Ni+Ge+β |
| Melting point (℃) | 221–225 |
| Shape | Ball |
| Flux Category *1 | ROL0 |
| Flux content (mass%) | 11.0 |
| Halogens | Present |
| Viscosity (Pa·s) | 200 |
| SIR (Ω) *2 | ≥1.0×109 |
| Electro-Migration test *3 | No abnormality |
| Spreading (%) | ≥70 |
*1 Flux category (halogen content of rosin-based flux): ROL0 0.0%, ROL1 <0.5%. *2 Insulation resistance (SIR): Condition B, 85±2℃, 80–90%RH, 168 h. *3 Electro-migration: Condition B, 85±2℃, 80–90%RH, 1000 h.
