| Manufacturer | NIHON SUPERIOR |
| Product Model | Solder Wire SN100CV (031) |
| Package | 0.3 / 0.4 / 0.5 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 mm; 500g/roll, 10 rolls/box (5kg) |
SN100CV(031) (Sn-Cu-Ni+Ge+β) is a new alloy that reduces the heat load and deteriorates the strength. Although it has no silver, it can maintain its strength in harsh environments. Ensuring continuous solderability, it can also greatly suppress the flux scattering. It is a Pb-free solder wire that can have both good workability and suppression of flux scattering.
Features
High workability
Excellent workability with a fast, even melt makes the wire easy to handle in both manual and automated soldering.
Suppressing the scattering of flux
Formulated to minimise flux spatter during soldering, keeping boards and work areas cleaner and reducing rework.
Specifications
*2 Insulation resistance value: Condition B 85±2℃, relative temperature and humidity 80~90%RH 168 hours
*3 Electromigration experiment: condition B 85±2℃, relative temperature and humidity 80~90%RH 1000 hours
Specification Table：
| Item | SN100CV(031) |
|---|---|
| Composition | Sn-0.7 Cu-0.05 Ni+Ge+β |
| Melting point (℃) | 221–225 |
| Flux Category *1 | ROL1 |
| Flux content (mass%) | 3.0 |
| Halogens | Present |
| SIR (Ω) *2 | ≥1.0×1010 |
| Electro-Migration test *3 | No abnormality |
| Spreading (%) | ≥80 |
*1 Flux category (halogen content of rosin-based flux): ROL0 0.0%, ROL1 <0.5%. *2 Insulation resistance (SIR): Condition B, 85±2℃, 80–90%RH, 168 h. *3 Electro-migration: Condition B, 85±2℃, 80–90%RH, 1000 h.
