Solder Wire SN100C (030)

Manufacturer	NIHON SUPERIOR
Product Model	Solder Wire SN100C (030)
Package	0.3 / 0.4 / 0.5 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 mm; 500g/roll, 10 rolls/box (5kg)

SN100C(030) (Sn-Cu-Ni+Ge) is a high-reliability tin wire with a fast melting speed, reducing the scorching of the soldering iron tip and flux flying with good soldering effect and improving work efficiency, productivity and economy.

Features

Reduced scorching

Fast, even melting reduces scorching of the iron tip, keeping it clean and extending tip life.

Reducing the scattering of flux

Formulated to minimise flux spatter during soldering, keeping boards and work areas cleaner and reducing rework.

Reducing residue cracking

Leaves a stable residue that resists cracking, maintaining a clean, reliable joint appearance over time.

Fast melting

A fast melting speed shortens the soldering cycle, improving throughput and overall efficiency.

Good continuous weldability

Delivers consistent, continuous solderability for stable results across long production runs.

Inhibiting cracks, copper corrosion, and alloy layer growth

The Ni + Ge additions inhibit joint cracking, copper erosion and excessive intermetallic (alloy-layer) growth for higher long-term reliability.

Specifications

*2 Insulation resistance value: Condition B 85±2℃at relative temperature and humidity 80~90%RH 168 hours

*3 Electromigration experiment: condition B 85±2℃at relative temperature and humidity 80~90%RH 1000 hrs

Reducing residue cracking.

Fast melting.

Good continuous weldability.

Item	SN100C(030)
Composition	Sn-0.7 Cu-0.05 Ni+Ge
Melting point (℃)	227
Flux Category ^*1	ROL0
Flux content (mass%)	3.0
Halogens	Present
SIR (Ω) ^*2	≥1.0×10⁹
Electro-Migration test ^*3	No abnormality
Spreading (%)	≥80

*1 Flux category (halogen content of rosin-based flux): ROL0 0.0%, ROL1 <0.5%. *2 Insulation resistance (SIR): Condition B, 85±2℃, 80–90%RH, 168 h. *3 Electro-migration: Condition B, 85±2℃, 80–90%RH, 1000 h.