| Manufacturer | NIHON SUPERIOR |
| Product Model | Solder Paste SN100CV P506 D4 |
SN100CV P506 D4 is a general-purpose lead-free solder paste with stable viscosity with good wetting climb and continuous printing; it also suppresses tin beading, pores, and wetting. It is a product with superior performance.
Features
No need to choose the environment
Stable viscosity and wetting give reliable printing and reflow across a wide range of working conditions.
Superior welding quality
Suppresses solder beading, voids and poor wetting to deliver consistently high joint quality.
Specifications
*2 Insulation resistance value: Condition B 85±2℃, relative temperature and humidity 80~90%RH 168 hours
*3 Electromigration experiment: condition B 85±2℃, relative temperature and humidity 80~90%RH 1000 hours
| Item | SN100CV P506 D4 |
|---|---|
| Composition | Sn-0.7 Cu-0.05 Ni+Ge+β |
| Melting point (℃) | 221–225 |
| Shape | Ball |
| Flux Category *1 | ROL1 |
| Flux content (mass%) | 3.0 |
| Halogens | Present |
| SIR (Ω) *2 | ≥1.0×1010 |
| Electro-Migration test *3 | No abnormality |
| Spreading (%) | ≥80 |
*1 Flux category (halogen content of rosin-based flux): ROL0 0.0%, ROL1 <0.5%. *2 Insulation resistance (SIR): Condition B, 85±2℃, 80–90%RH, 168 h. *3 Electro-migration: Condition B, 85±2℃, 80–90%RH, 1000 h.
