| Manufacturer | NIHON SUPERIOR |
| Product Model | Solder Wire SN100C (031) |
| Package | 0.3 / 0.4 / 0.5 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 mm; 500g/roll, 10 rolls/box (5kg) |
SN100C(031) (Sn-Cu-Ni+Ge) is a general-purpose Pb-free solder wire with excellent workability with fast melting speed, reducing flux scattering and residue. Due to the continuous weldability and scalability, the work efficiency is improved.
Features
High workability
Excellent workability with a fast, even melt makes the wire easy to handle in both manual and automated soldering.
Suppressing the scattering of flux
Formulated to minimise flux spatter during soldering, keeping boards and work areas cleaner and reducing rework.
Specifications
*2 Insulation resistance value: Condition B 85±2℃at relative temperature and humidity 80~90%RH 168 hours
*3 Electromigration experiment: condition B 85±2℃at relative temperature and humidity 80~90%RH 1000 hours
Specification Table：
| Item | SN100C(031) |
|---|---|
| Composition | Sn-0.7 Cu-0.05 Ni+Ge |
| Melting point (℃) | 227 |
| Flux Category *1 | ROL1 |
| Flux content (mass%) | 3.0 |
| Halogens | Present |
| SIR (Ω) *2 | ≥1.0×1010 |
| Electro-Migration test *3 | No abnormality |
| Spreading (%) | ≥80 |
*1 Flux category (halogen content of rosin-based flux): ROL0 0.0%, ROL1 <0.5%. *2 Insulation resistance (SIR): Condition B, 85±2℃, 80–90%RH, 168 h. *3 Electro-migration: Condition B, 85±2℃, 80–90%RH, 1000 h.
