Multi-Layer Board (MLB)

Multi-Layer Board (MLB) — Lincstech Co., Ltd.
ManufacturerLincstech Co., Ltd.
Product ModelMLB

Features

Patented technology

Fusion of the various processes and material technologies

Structural Electrical Properties

Achieving low loss and pulse wave optimization

Convenient to Work

Provide a stable electric performance with high layer count and efficient layer structure

Heat Resistant

High reliability with a global quality assurance system

Specifications

ItemMass productionTrial production
Max. Board Size600 mm × 560 mm
Max. Board Thickness7.4 mm
Max. Layer counts82102
Min. Drill size (TH)0.30 mm0.25 mm
Min. Drill size (SVH)0.15 mm0.1 mm
Impedance± 10%± 5%
Hybrid structureLW910G+FR4 (E679 or R1755S), Meg6+FR4 (E679 or R1755S)
OptionBVH, HPL, HP, HDI, Back Drill

Related Products