| Manufacturer | Lincstech Co., Ltd. |
| Product Model | Multi-Wire Board (MWB) |
Features
Proprietary processes
Inner layer traces to be formed by “Wiring of an insulated Cu wire”, instead of Print and Etch (P/E) Cu trace.
Design flexibility
Multi-wire construction lets designers route high-density, high-pin-count interconnections that are difficult to achieve with conventional rigid PCBs.
Signal control
Wire has stable dia., brings stable electrical characters on long race
Precise wire length control
MWB is able to cross wiring using the insulated wire and increase the signal accumulation.
Specifications
| Item | Mass production | Trial production |
|---|---|---|
| Max. Board Size | 580 mm × 550 mm | |
| Max. Board Thickness | 7.4 mm (SVH < 4.0 mm) | |
| Max. Layer counts | 56 | 68 |
| Min. Drill size (TH) | 0.25 mm | 0.20 mm |
| Min. Drill size (SVH) | 0.20 mm | 0.15 mm |
| Impedance | ± 10% | ± 5% |
| Hybrid structure | LW910G+FR4 (E679 or R1755S), Meg6+FR4 (E679 or R1755S) | |
| Option | BVH, HPL, HP, HDI, Back Drill | |
