| Manufacturer | Resonac(Hitachi Chemical) |
| Product Model | HCI-100 |
HCI series are high heat-resistant polyamide-imide resin solutions (Polyamide-imide, PAI). PAI is a thermosetting crystalline polymer with excellent heat resistance (Tg ≧270°C, thermal decomposition starting temperature ≧400°C), mechanical properties and chemical resistance and can form a strong coating on the surface of the object.
The solvent of HCI-100 is water + NMP. This product can be used for non-stick pan coating and lubricating coating for metal processing parts such as pistons and cams.
Specifications
Varnish & film properties: appearance (auburn transparent liquid), solid content, viscosity (25 ℃), solvent composition (NMP), adhesion (H₂O), glass-transition temperature Tg 284 ℃ (DSC), 5% decomposition temperature 456 ℃ (TGA).
