| Manufacturer | Showa Denko (Hitachi Chemical) |
| Product Model | AC-7813KM |
| Description | ACF for FOG connection |
Features
Corresponding to low temperature
Bonds at a lower temperature, reducing thermal stress on flexible circuits and widening the assembly process window.
2 layers/3 layers FPC can be applied
Suitable for bonding both 2-layer and 3-layer flexible printed circuits (FPC), covering a wide range of assemblies.
Corresponding to small connection area
Maintains reliable conduction on small, fine-pitch connection areas, supporting high-density and miniaturised designs.
Easily operating
Wide pressure temperature range, easy to operate
Specifications
165℃ / 5 sec
165℃ / 5 sec
| Item | AC-7813KM (for FPC 2/3-layer) |
|---|---|
| Thickness (µm) | 25 |
| FPC electrode (µm) | 18~36 |
| Conductive particle – Type | Ni-plated plastic particle |
| Conductive particle – Size (µm) | 5 |
| Conductive particle – Density (pcs/mm²) | 5,000 |
| Min. contact area (µm²) | 13,000 |
| Min. space (µm) | 15 |
| Lamination – Temperature (°C) | 60~100 |
| Lamination – Time (s) | 1~3 |
| Lamination – Pressure (MPa) | 1 |
| Final bonding – Temperature (°C) | 165~205 |
| Final bonding – Pressure (MPa) | 2~4 |
